US Launches $200 Million Edge AI Smartphone Funding for Indo-Pacific

The United States Department of State has unveiled a new funding initiative worth up to $200 million aimed at expanding access to secure, high-quality, and affordable smartphones across the Indo-Pacific region.

Called the Edge AI Package, the programme is designed to support companies and organisations that propose ways to accelerate the deployment of handheld smartphone devices running trusted operating systems such as Android and iOS. The goal is to help integrate the next billion internet users into an open, interoperable digital ecosystem that encourages innovation and connectivity.

Under the programme, interested parties can submit proposals over a 90-day window. The awards will be made through a competitive process, with funding ultimately subject to availability and approval by the US Congress. Potential applicants are instructed to contact the State Department for more details and technical requirements.

According to official statements, the Edge AI Package aligns with broader American efforts to promote digital security and counterbalance “high-risk” technology providers whose products are seen as potential threats to infrastructure integrity. By fostering alternatives rooted in trusted software and hardware ecosystems, the initiative aims to ensure partner nations in the region are not reliant on vendor technologies that could compromise autonomy or expose users to coercive influence. The funding push is part of the State Department’s larger vision for a flourishing, interconnected Indo-Pacific. Officials describe the effort as bolstering both economic opportunity and technological resilience, with a focus on empowering developers and entrepreneurs to build tools and services that harness artificial intelligence at the edge.

This initiative is closely tied to Pax Silica, a strategic framework launched by the US in late 2025 to secure supply chains in semiconductors, artificial intelligence and related critical technologies among allied and partner countries. Pax Silica seeks to deepen cooperation on advanced technology infrastructure, build trusted networks of innovation, and reduce dependence on non-aligned nations for key digital components.

India is set to formally join the Pax Silica initiative in February 2026, a move that Washington and New Delhi have described as a significant step in deepening technological cooperation. India’s participation is expected to bring its large talent pool and growing semiconductor ambitions into the alliance, positioning the country as an important contributor to shaping future technology standards and industry ecosystems.

By linking the Edge AI Package to the goals of Pax Silica, the United States aims to reinforce a shared digital architecture among friendly nations, promote secure technology adoption, and support economic development through enhanced access to modern communication tools. The announcement comes amid ongoing global competition over digital markets and supply chains, with the US government increasingly focused on providing alternatives to technologies from providers seen as less aligned with democratic values and trusted governance.